There are currently two factories in Taiwan focused on 2nm production: the Baoshan and Kaohsiung factories. TSMC reportedly has an initial wafer output target of 5,000 wafers at its Kaohsiung factory during the trial production period, as is the output target at its Baoshan factory. Now, the whistleblower @Jukanlosreve detailed information published in the Economic Daily mentioned that at the current level of progress, TSMC has the ability to achieve the goal of producing 50,000 wafers per month by the end of this year.
TSMC achieved the milestone of 60% yield in the pre-production phase, and pre-production will soon move to full production as the Taiwanese foundry giant ramps up production to meet customer demand for next-generation chips in a variety of applications. According to sources familiar with the situation, the company’s monthly wafer production could reach 50,000 pieces, with the possibility of reaching 80,000 by the end of 2025.

One of TSMC’s factories in Taiwan can produce up to 25,000 pieces a month, but rumors say the company is still looking for ways out of the pilot production phase.
However, if there are no problems in the production process, it is entirely possible that this number can reach 80,000 units. Unfortunately, TSMC has not made any confirmation on this, and the foundry giant has only said that it is making progress in this area. Industry sources close to the company’s plans mentioned that the Baoshan plant’s capacity has reached 25,000 wafers per month, which only means that the remaining 25,000 wafers will be mass-produced by the Kaohsiung plant.
In a side-by-side comparison, the company performed significantly better than Samsung, which only achieved a 30% yield rate of its 2nm GAA technology during the pre-production phase of the Exynos 2600.